QIANLI iBlack 3D Steel mesh Reballing Stencil for Android Qualcomm EMMC MSM EMMC General DDR KIRIN 655 659 MSM 8937 2AA MTK 6582 Options:EMMC General DDR WYLIE 850A+ pump hot air
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QIANLI iBlack 3D Steel mesh Reballing Stencil for Android Qualcomm EMMC MSM EMMC General DDR KIRIN 655 659 MSM 8937 2AA MTK 6582 Options:EMMC General DDR WYLIE 850A+ pump hot airProduct introduction: QianLi Toolplus Black stencil makes positioning your chip much easier and 100% accurate. Enabling you to work faster and perform a perfectly precise job every time you reball a chip using this stencil. Details: DESIGN Designed to help with repairsDURABLE Easy to work withSIZE Standard size3D Better positioning Product Features: 1. Square hole technology2. Toughness, high temperature resistance and deformation3. New upgrade and
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