QIANLI iBlack 3D BGA Stencil A7 A8 A9 A10 A11 CPU RAM For iPhone 5S 6G 6Plus 6S 6SP 7 7P 8 8P Layer Reball IC Steel Mesh Tin Net option:A9 CPU RAM 3D Application: Machine for Iphone chip
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QIANLI iBlack 3D BGA Stencil A7 A8 A9 A10 A11 CPU RAM For iPhone 5S 6G 6Plus 6S 6SP 7 7P 8 8P Layer Reball IC Steel Mesh Tin Net option:A9 CPU RAM 3D Application: Machine for Iphone chipPRODUCT INTRODUCTION Place of Origin: Guangdong, China(Mainland) Brand Name: QianLi Model Number: 3D Android Black Stencil MSM 8937 2AA Material: Aluminum PRODUCT FEATURES Description: Quanli 3D Android Black Stencil MSM 8937 2AAQualcomm Snapdragon Function: Reballing IC pins
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