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Mijing MJ-501A 501B 503A 503B 183 138℃ Mobile Phone Motherboard Repair, Low Temperature Solder Paste, Soldering Material Tools Zenfone Series For Asus Zenfone C Product size: 35cm * 21cm

Mijing MJ-501A 501B 503A 503B 183 138℃ Mobile Phone Motherboard Repair, Low Temperature Solder Paste, Soldering Material Tools Zenfone Series For Asus Zenfone C Product size: 35cm * 21cm

Name: Mijing MJ-501A 501B 503A 503B 183 138℃ Mobile Phone Motherboard Repair, Low Temperature Solder Paste, Soldering Material Tools Zenfone Series For Asus Zenfone C Product size: 35cm * 21cm
Brand: avramcheva.com
SKU: 91222207839
Price: 17.30 USD
Availability: InStock
Rating: 4.6759 (10 reviews)

SKU: 91222207839

4.7

SEK17.30 SEK64.30

Pay in 4 interest-free payments of $4.33 Learn more

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Ships within 48 hours · Estimated delivery Aug 20 - Aug 25

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Mijing MJ-501A 501B 503A 503B 183 138℃ Mobile Phone Motherboard Repair, Low Temperature Solder Paste, Soldering Material Tools Zenfone Series For Asus Zenfone C Product size: 35cm * 21cmProduct introduction1. Unique recipes, perfect performance, easy to weld, solder bright and full, no weld, false welding and so on2. Good soldering and welding tool3. Advanced insulation technology, a high viscosity no clean flux, it can be used for PCB, SMD reworking, as well as reballing of computer and phone chips. 4. The mixture of high quality alloyed powder and resinic pasty flux, which avoid the pale yellow residue, so you are easy to clean the

Store: avramcheva.com · Domain: avramcheva.com

Description

Product size: 35cm * 21cm * 55cm

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Package: Case

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