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MJ BGA Reballing Solder Stencil Plant Tin Net for MTK CPU OPTION:MT-2 heat dissipation

SKU: 956010331

4.7
EUR21.42 EUR67.42

Pay in 4 interest-free payments of $5.36 Learn more

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Ships within 48 hours · Estimated delivery Aug 3 - Aug 8

Live Spec

MJ BGA Reballing Solder Stencil Plant Tin Net for MTK CPU OPTION:MT-2 heat dissipationPRODUCT INTRODUCTIONType: Hand Tool PartsOrigin: CN(Origin)is_customized: NoMaterial: Aluminium copper AlloyUsage: Commercial Manufacture PRODUCT FEATURES* Stepped groove design enables stencil to align with the tinning position of ic rapidly.* The square holes design makes it easier to take out the formed solder balls.* The high success rate of planting tin, the solder balls can be formed once after you are proficient.

Store: avramcheva.com · Domain: avramcheva.com

Description

heat dissipation

This is a brand new high quality Samsung S10E LCD with Touch + Frame Prism Black

Bamboo material

Put the sillica gel on the heated plate holes to holes

Equipped with imported ceramic heating core with fast heating

MJ BGA Reballing Solder Stencil Plant Tin Net for MTK CPU OPTION:MT-2 heat dissipationPRODUCT INTRODUCTIONType: Hand Tool PartsOrigin: CN(Origin)is_customized: NoMaterial: Aluminium copper AlloyUsage: Commercial Manufacture PRODUCT FEATURES* Stepped groove design enables stencil to align with the tinning position of ic rapidly.* The square holes design makes it easier to take out the formed solder balls.* The high success rate of planting tin, the solder balls can be formed once after you are proficient.

Exchange/Return Notes
  • We offer a 30-day return/exchange service after receiving.
  • Final sale items are not eligible for returns or exchanges.
  • To process your return/exchange, please contact us at [email protected]
  • Please click here for more details>>> Return & Exchange Policy

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