RMA-424 T3-T6 - Sn42Bi57.6Ag0.4 low-temperature no-clean rosin mildly active solder paste 0.4% silver (ROL0) F Low QC-Aid™ No Yes

Low QC-Aid™ No Yes

Hydra-PRO-LF-TF water-soluble resin-based more activity synthetic tacky paste flux (REM1) with QC-Aid optical tracer

HT-AG5 - Sn95Ag5 high-temp lead-free solder wire NC-core ROL0 - 100g spool

such as inadequate thermal vias or insufficient copper thickness

- Superior dispensing

RMA-424 T3-T6 - Sn42Bi57.6Ag0.4 low-temperature no-clean rosin mildly active solder paste 0.4% silver (ROL0) F Low QC-Aid™ No YesLow temp solder paste for electronics assembly using rosin mildly activated solder tacky paste flux Used for attachment of temperature sensitive components to printed circuit boards, step soldering, warpage prevention, flexible circuits and large area array devices. Delivers reliable solder connections with low temperature reflow. Solders low Tg flexible boards and circuits used in phones, wearables and IoT devices Low temp BGA paste reduces HIP (head