Koch Chemie Micro Cut Pad Coatings & Sealants and can still absorb streak

and can still absorb streak free when slightly damp

Abrasive sponge for removing strong weathering and deep scratches using the Heavy Cut H9

orbital 3mm stroke DT-XF 3

Improved agility ensures easy handling and brilliant results

Compression hardness: 10

Koch Chemie Micro Cut Pad Coatings & Sealants and can still absorb streakMicro Cut Pad High quality special sponge for removing fine scratches, holograms and polishing marks using the Micro Cut M3. 02 and Micro Cut & Finish P3. 01. The short height of 23mm creates low torsion forces, very good handling and the highest level of stability. The special density of the foam material enables long lasting compression hardness during polishing. The optimized reticulation (open cellular structure) and cell count contribute to a