MECHANIC HEAT AIR Intelligent Preheating Platform For iPhone X-16 PRO MAX Motherboard Layered Chip BGA Stencil/Dot Matrix Repair Voltage::110V Support soldering handle: T210
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MECHANIC HEAT AIR Intelligent Preheating Platform For iPhone X-16 PRO MAX Motherboard Layered Chip BGA Stencil/Dot Matrix Repair Voltage::110V Support soldering handle: T210Description Mechanic Heat Air constant temperature desoldering preheating platform for iPhone X 11 12 13 14 15 16 Pro Max motherboard layering bonding repair. Intelligent Mechanic Heat Air desoldering station for mobile phone motherboard layered, degumming, tin planting, lamination, delamination, reflow welding, desoldering, and soldering repair. Packing list(standard): Host + Common module + power cord + box. Packing list(X 16 PM): Standard kit +
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